Category: 201907
Nanjing Agricultural University researches agricultural application LED results
Panasonic develops new voltage-tolerant technology for nitriding (GaN) transistors on Si substrates
A new trend in LED heat dissipation - LED 矽 substrate package thermal conductivity
The trend of future heat sink substrates with high power LEDs
Hongli representatives participate in the AOM 2010 Summit Forum
Introduction and discussion of high power LED packaging technology and solutions
Samsung's strong layout LED 2010 revenue is expected to reach 1.2 billion US dollars