On March 15, 2011, the People's Bank of China issued the "People's Bank of China's Opinions on Promoting the Application of Financial IC Cards" and decided to formally start the bank card chip migration nationwide (ie EMV migration). EMV migration is an important strategic measure implemented by China in recent years to adapt to the development trend of international bank cards, based on national conditions, improve finance, serve people's livelihood, increase the level of electronic payment risk prevention, and promote the upgrading of the bank card industry. The People's Bank of China regards the promotion of the application of the financial IC card industry as a major development strategy, and organizes the banking industry to carry out EMV migration in a planned and step-by-step manner. During the "Twelfth Five-Year Plan" period, the process of chipping bank cards will be accelerated, and the application of financial IC cards will be comprehensively promoted to promote the industrial upgrading and sustainable development of Chinese bank cards.
Speed ​​up the construction of financial IC chip detection system
There are many technological links in the entire process from design to product of the financial IC card, which are still in the "bottleneck" state. Mass production testing of the chip is one of them.
The chip is the basic carrier of the integrated circuit financial card and the core part of the EMV migration. Taking into account the national financial security issues, the relevant departments also called for adopting a method similar to the second-generation resident ID chip, and must realize the localization of the financial IC card chip. Many well-known domestic smart card chip companies, such as Beijing Zhongdian Huada Electronic Design Co., Ltd., Shenzhen National Technology Co., Ltd., Beijing Tongfang Microelectronics Co., Ltd., Shanghai Huahong Integrated Circuit Co., Ltd., Shanghai Huahong NEC, Datang Microelectronics Technology Co., Ltd., Shanghai Fudan Microelectronics Group Co., Ltd., etc. have invested huge amounts of money, human and material resources to actively develop, and have launched financial card chips that meet their PBOC standards. These new products have reached international standards in terms of specifications and capacity, and some have passed the safety certification of international and domestic standards. Compared with similar foreign products, the domestically developed financial IC card chips have different characteristics in terms of security design and guarantee of chip quality. However, so far, the financial IC cards officially issued in China are all foreign. Chips provided by companies such as Infineon Technologies and NXP. In addition to the level of chip design, the most important reason is that China ’s own financial IC card chip testing and certification system has not been established. All certifications are also controlled by foreign testing institutions, so there is no equivalent to international financial testing institutions. Interoperability certification status.
On December 5, 2012, Li Dongrong, Vice President of the People's Bank of China, said at the Financial Mobile Payment Technology Innovation Seminar that the construction of the financial IC card chip testing and certification system began. At present, the leading unit for financial IC card chip product certification is the Bank Card Testing Center (BCTC), which is an independent third-party professional and technical testing agency authorized by the People ’s Bank of China to undertake China ’s bank card and its acceptance terminal equipment and other products The main responsibility of the testing is to test and certify the samples of financial IC cards submitted for inspection in accordance with the relevant technical quality standards of the international, national and financial industries (such as the PBOC2.0 / 3.0 standard).
However, the purpose of BCTC's testing is to certify the products to be inspected, which generally takes a long time and the testing cost is also very expensive. If the financial IC card is officially issued, it requires large-throughput batch testing capabilities, which is not a task that BCTC can complete. According to industry analysts, if the bank magnetic stripe card replacement "core" can be completed in early 2015, the combined number of magnetic stripe cards that need to be replaced each year and the number of new cards issued will reach about 700 million. It can be seen that there are many technological links in the entire process from design to product of the financial IC card chip, and the mass production test of the chip is one of them. It is necessary to accelerate the construction pace to meet the needs of China's EMV migration strategy.
Financial IC card testing continues to increase in complexity
The increasing complexity of financial IC card testing has led to high testing costs, which has attracted great attention from enterprises in the industrial chain.
The biggest difference between the financial IC card chip and the general smart card chip is that the requirements for information security are very high, and the chip application environment is quite complex. Therefore, financial IC card chips have their particularities from chip design to manufacturing, and the realization of these particularities makes the complexity of such chip testing greatly increased. First, compared with conventional smart card chips, the encryption algorithm of financial card chips is more complicated. In addition to supporting internationally-used security algorithms, it also supports domestic commercial cryptographic algorithms, such as SM1 / SM2 / SM3 / SM4, and multiple algorithms coexist. It requires the chip's algorithm processor to have more comprehensive functions, richer instructions, and faster processing speed. Only test equipment that uses higher technical indicators can be competent, resulting in increased test costs. Second, the most important feature of the financial card chip is a more comprehensive anti-attack security strategy, so a large number of anti-attack security modules are designed inside the chip, including anti-power consumption analysis (SPA / DPA), resistance to temperature attacks, optical attacks, Voltage attacks, frequency attacks, anti-differential error analysis, etc., further increase the difficulty of testing; third, the financial card not only covers all the functions of the previous magnetic stripe card, but also can achieve multi-use of one card, integrating more financial and even non-linear The financial function is in one card, which means that the COS in the card changes a lot, and its testing tends to be more complicated; fourth, the coexistence of multiple memories in the financial card, ROM, RAM, especially EEPROM, FLASH may be introduced in the future, and The capacity is also getting larger and larger, because the test methods of different memories are different, and the test time of the memory is very long, which is one of the main factors affecting the test cost of financial card chips; Fifth, the PBOC3.0 standard stipulates that all new financial development IC cards need to support dual-interface applications (that is, support both contact and non-contact interfaces), financial card applications are more widespread, but chip testing is more difficult , Especially multi-chip parallel test more difficult; the sixth, despite a huge number of commercial financial card issuers, which means unlimited. However, unlike the second-generation ID card issuance model, the issuance of financial cards is entirely a market mechanism. In order to gain advantages in competition, domestically developed financial card chips must not only ensure chip function and quality, but also greatly reduce costs. Industrial testing of card chips must ensure chip function, quality, time and cost requirements. Of course, there are many test challenges, so I wo n’t go into details.
Through the above analysis, we know that the financial IC card chip is the most important link of EMV migration, and testing is the key to ensuring the quality of the chip, which runs through the design, manufacturing and packaging of the financial IC card chip industry chain. Generally, the three forms of test verification, wafer test (CP) and finished product test (FT) play a role in the industry chain. The main purpose of the test verification is to evaluate whether the chip function meets the specification requirements, and the BCTC detection is corresponding to this link. CP and FT are the corresponding industrial tests for chip manufacturing. The importance of testing and the high cost of testing have increasingly attracted the attention of enterprises in the industrial chain.
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