The difference between this technology and the traditional package is that the traditional package is to place the chip on the substrate, and then the connection point between the chip and the substrate is connected by the wire bonding technology; and the flip chip technology is The bumps are directly connected to the substrate by flipping the chip by using bumps made on the chip connection points.
At present, the research and development of flip chip technology in foreign countries and Taiwan is close to maturity, but for the domestic market, the progress is still slightly slow. However, there are also some highlights. According to the reporter, since the beginning of this year, high-power flip chip products used in the field of outdoor lighting have gradually increased in this type of lighting market due to their unique characteristics.
After the flip chip technology adopts the flip-chip package form, since the electrode is directly in contact with the heat dissipation substrate, there is no need to dissipate heat through the sapphire, and the heat dissipation performance of the product is improved, and the current drive can be withstood. Therefore, the excellent performance of flip chip technology makes it better suited for outdoor high power package products with high current tolerance.
In addition, for the package manufacturer, after the flip chip technology, the product volume can be reduced because the process steps of the wire bonding can be saved, and the light source device can adopt a high-density package form. According to a professional from a packaging manufacturer in Shenzhen, the high-density packaging form unique to flip chip technology makes it a great advantage in high-power package products with higher requirements for light source concentration.
September 26th, 14:00-17:30, September 27th, 9:30-17:30, "The 12th High-tech LED Industry Summit Forum and LED Supply Chain Brand Summit" will be held at Guangzhou Pazhou Canton Fair Held (2014 High-tech LED Exhibition held concurrently). At that time, the conference will invite representatives of the LED lighting source and the upstream and downstream representative of the lighting supply chain. Everyone will talk freely and discuss the transformation and development of the supply chain in the era of LED lighting market.
Judging from the current market conditions, although the flip chip technology cannot be the mainstream of the entire packaging industry due to high product yield and high input cost, its high-density and high-current characteristics have already risen in the field of high-power LEDs. A revolution. Looking to the future, it will also have a broader development prospect in the entire packaging application market.
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