[Source: "High-tech LED" magazine March issue (total issue 63) | Yimeixinguang Executive Vice President / CTO Liu Guoxu] In the past ten years, white LED packaging has evolved with the development of technology and market International mainstream LED devices have experienced high-brightness HB-LED (1W, 350mA standard drive current) represented by ceramic package to mid-power MPLED represented by PLCC bracket structure (0.2- Center-of-gravity offset of 0.8W, 60-260mA drive current). The main reasons for this trend are briefly summarized as the following two points:
First of all, with the maturity and industrialization of medium power in TV backlight applications, the scale effect and targeted technology optimization have rapidly improved the performance of medium power LED chips, and the breakthrough in packaging cost improvement has made it possible to achieve light efficiency (lm/ W) is still better than the ceramic high-power package (lm / $). Under the general trend of LED penetration into the general lighting market, the medium power package fully exploits the high energy efficiency of the LED light source, and approaches the traditional light source step by step in price, which is quickly accepted and recognized by the market.
Second, from an application point of view, LED lighting has been mainly used in replacement lamps in the past few years. In particular, A-Lamp bulbs and T8 lamps have developed most rapidly, with the largest market increase. From the perspective of power supply configuration, heat dissipation structure, and optical effect, medium power LEDs are more suitable for bulb lamps and lamps than high power ceramic LEDs, and the medium cost performance makes them widely used in bulb lamps. If high power is used in T8 lamps or flat lamps, the spot is the most difficult problem to overcome, and the use of multiple small and medium power LEDs not only has higher light efficiency, but also effectively avoids the occurrence of spot problems.
The rise of mid-power packages has forced ceramic high-power gradual high-wattage luminaires and applications with directional requirements to find a way out. At present, ceramic high power has advantages in small illumination angle MR spotlights, partial downlights, and high bay lights. At the same time, due to its better heat dissipation performance and high reliability in harsh environments, high-power ceramic packages still occupy the main outdoor lighting application market, including street lamps and tunnel lights.
However, with the introduction of thermosetting materials such as EMC and SMC in the PLCC bracket, the PLCC bracket package is gradually improved from the conventional high-temperature and yellowing resistance of the thermoplastic PPA or PCT. Previous low to medium power extended to medium and high power. Currently 1W - 1.5W LED brackets with EMC brackets are widely used in the market and verified for reliability.
At the same time, another form of COB is gradually being applied in compact light-emitting surfaces and high optical density applications. COB is an array package that fixes multiple chips on a metal or ceramic substrate. It eliminates the need for a single LED package, directly crystallizes the blue chip and then coats the phosphor, making it more flexible to select various types. A chip of power or size is densely connected in series on the substrate, and then the solder paste wire or the connector is used to introduce the driving power.
COB penetrates rapidly in commercial applications such as MR16 and PAR Reflector, and has good light pattern and color space uniformity. With the maturity of flip-chips, the flexibility of gold-free wire design, and the heat dissipation and reflectivity of substrate materials, it has become possible to integrate dozens or even hundreds of blue LEDs onto the same substrate. This further realizes the Super-high Power (SP-LED) COB package. It is foreseeable that high optical density COB will occupy a place in the replacement of metal halide lamps and high wattage luminaire applications.
First of all, with the maturity and industrialization of medium power in TV backlight applications, the scale effect and targeted technology optimization have rapidly improved the performance of medium power LED chips, and the breakthrough in packaging cost improvement has made it possible to achieve light efficiency (lm/ W) is still better than the ceramic high-power package (lm / $). Under the general trend of LED penetration into the general lighting market, the medium power package fully exploits the high energy efficiency of the LED light source, and approaches the traditional light source step by step in price, which is quickly accepted and recognized by the market.
Second, from an application point of view, LED lighting has been mainly used in replacement lamps in the past few years. In particular, A-Lamp bulbs and T8 lamps have developed most rapidly, with the largest market increase. From the perspective of power supply configuration, heat dissipation structure, and optical effect, medium power LEDs are more suitable for bulb lamps and lamps than high power ceramic LEDs, and the medium cost performance makes them widely used in bulb lamps. If high power is used in T8 lamps or flat lamps, the spot is the most difficult problem to overcome, and the use of multiple small and medium power LEDs not only has higher light efficiency, but also effectively avoids the occurrence of spot problems.
The rise of mid-power packages has forced ceramic high-power gradual high-wattage luminaires and applications with directional requirements to find a way out. At present, ceramic high power has advantages in small illumination angle MR spotlights, partial downlights, and high bay lights. At the same time, due to its better heat dissipation performance and high reliability in harsh environments, high-power ceramic packages still occupy the main outdoor lighting application market, including street lamps and tunnel lights.
However, with the introduction of thermosetting materials such as EMC and SMC in the PLCC bracket, the PLCC bracket package is gradually improved from the conventional high-temperature and yellowing resistance of the thermoplastic PPA or PCT. Previous low to medium power extended to medium and high power. Currently 1W - 1.5W LED brackets with EMC brackets are widely used in the market and verified for reliability.
At the same time, another form of COB is gradually being applied in compact light-emitting surfaces and high optical density applications. COB is an array package that fixes multiple chips on a metal or ceramic substrate. It eliminates the need for a single LED package, directly crystallizes the blue chip and then coats the phosphor, making it more flexible to select various types. A chip of power or size is densely connected in series on the substrate, and then the solder paste wire or the connector is used to introduce the driving power.
COB penetrates rapidly in commercial applications such as MR16 and PAR Reflector, and has good light pattern and color space uniformity. With the maturity of flip-chips, the flexibility of gold-free wire design, and the heat dissipation and reflectivity of substrate materials, it has become possible to integrate dozens or even hundreds of blue LEDs onto the same substrate. This further realizes the Super-high Power (SP-LED) COB package. It is foreseeable that high optical density COB will occupy a place in the replacement of metal halide lamps and high wattage luminaire applications.
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